Home page | Chip Production | People | Publication List | Results

· 0.15um OKI FD-SOI technology

· 160x50 digital pixels (10x10 um²)

· 160x100 analog pixels (10x10 um²)

· MIPs detection

· 0.20um OKI FD-SOI technology

· 256x256 analog pixels (13.75x13.75 um²)

· 5x5mm² chip, 3.2´3.2mm²

· 4 analog outputs

· 0.20um OKI FD-SOI technology

· 512x380 analog pixels (13.75x13.75 um²)

· High Resistivity substrate

· To be received and tested soon

· 0.20um OKI FD-SOI technology

· 256x256 analog pixels (13.75x13.75 um²)

· 8 different pixel layouts to screen the back-gating effect

· Thinned to 70um and back-processed

· Tested with MIPs at CERN

· Tested with soft X-rays at the Advanced Light Source (ALS) at LBNL

· 0.20um OKI FD-SOI technology

· 128x172 digital pixels (20x20 um²)

· 40x172 analog pixels (20x20 um²)

· Optimized for low leakage current

LDRD-SOI-1 (2007)

SOImager-2 (2010)

SOImager-3 (2011)

SOImager-1 (2009)

LDRD-SOI-2 (2008)

Chip Production

SOIPD

Welcome to the Web Page of the SOIPD Project